2.2.2 IRQ_SW1 and IRQ_SW2 Push Switches
Push switches SW1 and SW2 provide an active low signal when depressed to MCF56F8006
ports PB2 and PB3 respectively. See options JP1 and JP2 to change the input ports applied.
2.2.3 Y2 Crystal Reference
Y2 provides a location for an external 32 kHz can crystal to be applied to the MC56F8006. Refer
to the device user manual for crystal application information. Components R47, R48, C40 and
C41 must also be applied with the crystal. Refer to the MC56F8006DEMO schematic diagram for
component connection details.
2.3 Ports and Connectors
2.3.1 J4: USB port
J4 will provide a single connection to power the MC56F8006DEMO board. Supporting host
software for basic operation is provided on the support DVD. The current release will provide a
virtual serial terminal port.
2.3.1.1 STATUS and TPWR Indicators
These indicators provide USB operation status indication. Status will flash or blink to indicate
operation. TPWR will be on when target power is enabled from the USB port.
2.3.2 PWR Jack
This connector provides external power input to the board. The PWR jack accepts a standard
2.0 ~ 2.1 mm center barrel plug connector (positive voltage center) to apply a +VIN supply of +5
VDC to +12V. Also review option jumper JP3 and JP4 operation for power application. External
power is not required when applying the USB development port, J4.2.3.2.1 POWER Indicator The
POWER indicator will be on when the MC56F8006DEMO board has +3.3V available for operation.
2.3.3 +3.3 V and GND Test Points
Test point pads are provided for access to VSS/Ground and the +3.3V power signal on the board.
2.3.4 COM Port
The COM port connector and supporting interface circuit is not populated by default. The USB
development port J4 may provide serial port connection to the MC56F8006 SCI if wanted. Refer
to the TX_EN and RX_EN option jumpers and the J4 USB BDM connection for more details.
Components required to apply the COM port are following:
? U2: MAX3232CPWR, TI or same, note
? COM: Generic 9 pin D-Sub connector, R/A female or socket type, .318 mount hole to PCB
pin distance
? C7, C8, C9, C10 and C11: SMT 0805 0.1 μF X7R 50V capacitors
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相关代理商/技术参数
MC56F8006DEMO-T 制造商:Freescale Semiconductor 功能描述:MC56F8006DEMO board including USB TAP
MC56F8006DEMO-T-PROMO 制造商:Freescale Semiconductor 功能描述:KIT DEMO MC56F8006 DSC BOARD
MC56F8006MLC 制造商:Freescale Semiconductor 功能描述:DSC 32LQFP 16K FLASH - Bulk
MC56F8006VBM 功能描述:数字信号处理器和控制器 - DSP, DSC DSC 32SDIP 16K Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8006VLC 功能描述:数字信号处理器和控制器 - DSP, DSC DSC 32LQFP 16K Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8006VLF 功能描述:数字信号处理器和控制器 - DSP, DSC DSC 48LQFP 16K Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8006VLF 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 16KB 32MHZ 3.6V LQFP-48
MC56F8006VWL 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT